Metal
Oxide Semiconductor FET
Introduction.
Symbol:
·
The Metal Oxide
Semiconductor Field Effect Transistor (MOSFET) is one type of FET transistor.
·
In MOSFET the gate terminal is electrically
insulated from the current carrying channel so it is called as IG-FET.
·
Due to the insulation
between gate and source terminals the input resistance of MOSFET may be in mega
ohms (MΩ).
·
MOSFET also acts as a voltage controlled
resistor when no current flows into the gate terminal.
·
The small voltage at the gate terminal
controls the current flow through the channel between the source and drain
terminals.
·
MOSFET terminals are, Drain (D), Source (S), Gate (G)
and substrate.
·
The MOSFETs are available in both types, N-channel (NMOS) and
P-channel (PMOS).
·
The MOSFETs are
basically classified in to two forms they are Depletion type and Enhancement
type transistors.
Working Principle of MOSFET:
·
The
aim of the MOSFET is to control the voltage and current flow between the source
and drain. It works almost as a switch.
·
The
working of MOSFET depends upon the MOS capacitor. The MOS capacitor is the main
part of MOSFET.
·
The
semiconductor surface at the below oxide layer
is located between source and drain terminal.
·
It
can be inverted from p-type to n-type by applying a positive or negative
gate voltages .
·
When
we apply the positive gate voltage the holes present under the oxide layer with
a repulsive force and holes are pushed downward with the substrate.
·
if
a voltage is applied between the drain and source, the current flows freely
between the source and drain and the gate voltage controls the electrons in the
channel.
·
Instead
of positive voltage if we apply negative voltage , a hole channel will be
formed under the oxide layer.
In general, any
MOSFET is operated in three regions :
1.
Cut-Off Region
In this region MOSFET will be in OFF state. No current flow through it. It behaves as open switch and is used as electronic switches.
In this region MOSFET will be in OFF state. No current flow through it. It behaves as open switch and is used as electronic switches.
2.
Ohmic or Linear Region
In this region the current IDS increases with increasing of VDS. This region, is used as amplifiers.
In this region the current IDS increases with increasing of VDS. This region, is used as amplifiers.
3.
Saturation Region
In this region, IDS is constant by increase in VDS and once VDS exceeds the value of pinch-off voltage VP. the device will act as closed switch.
In this region, IDS is constant by increase in VDS and once VDS exceeds the value of pinch-off voltage VP. the device will act as closed switch.
Construction of an EMOSFET:
1.
The main difference
between the construction of DE-MOSFET and
E-MOSFET, is that E-MOSFET substrate extends all the way to the
silicon dioxide (SiO2) and no channels are doped between the
source and the drain.
2.
Channels are
electrically induced in these MOSFETs, when a positive gate-source voltage VGS is
applied to it.
Operation of an EMOSFET:
1.
This MOSFET operates
only in the enhancement mode and has no depletion mode.
2. It operates with large positive gate voltage
only. It does not conduct
when the gate-source
voltage VGS = 0, is called MOSFET –off.
3.
Drain current ID flows
only when VGS exceeds VGST [gate-to-source threshold
voltage].
4.
When drain is positive
w.r.to source and no potential is applied to the gate.
5.
Then two P-N junctions
connected back to back with a resistance of the P-substrate.
6.
A very small drain current i.e, reverse leakage
current flows.
7.
If P-type substrate is
connected to the source terminal, then zero voltage lies across the source
substrate junction, and the–drain-substrate junction remains
reverse biased.
8.
When the gate is made
positive w.r.to the source and the substrate, negative (i.e. minority) charge
carriers within the substrate are attracted to the positive gate and accumulate
close to the-surface of the substrate.
9.
As the gate voltage is increased, more and
more electrons accumulate under the
gate.
10.
These electrons flow
across the insulated layer to the gate, so they accumulate at the surface of
the substrate just below the gate.
11.
These accumulated
minority charge carriers N -type channel stretching from drain to source.
12.
Then an inversion
layer (N-type) is induced in channel. Now a drain current start
flowing.
13.
The strength of the
drain current depends upon the channel resistance and number of charge carriers
attracted to the positive gate. Thus drain current is controlled by the gate
potential.
14.
The conductivity of
the channel is enhanced by the positive bias on the gate so this device is
called the enhancement MOSFET or E- MOSFET.
15.
E-MOSFET is classified
as an enhancement-mode device because its conductivity depends on the action of
the inversion layer.
16.
Depletion-mode devices
are normally ON when VGS = 0, whereas the enhancement-mode
devices are normally OFF when VGS = 0.
Characteristics of an EMOSFET.
Drain Characteristics-EMOSFET
1.
When VGS < VGST then ID =0. When VGS is
greater than VGST, then device turns- on and ID is controlled by the gate voltage.
2.
The characteristic curves have almost vertical
and almost horizontal parts.
3.
Thus E-MOSFET can be used as a
variable-voltage resistor (WR) or as a constant current source.
EMOSFET-Transfer Characteristics
1.
The current IDSS at
VGS <=0 is very small, of a few nano-amperes.
2.
When VGS is
positive, then ID increases slowly at first, and then much more
rapidly with an increase in VGS.
The equation for the transfer characteristic of E-MOSFETs is
given as:
ID=K(VGS-VGST)2
·
For zero value of VGS,
the E-MOSFET is OFF because there is no conducting channel between source and
drain.
·
The symbols has broken
channel line to indicate the normally OFF condition.
·
VGS exceeding the threshold
voltage VGST, an N-type inversion layer, connecting the source to
drain, is created.
·
The depletion mode
MOSFETs are generally known as ‘Switched ON’ devices,
·
These are generally closed when there is no bias
voltage at the gate terminal.
·
If the gate voltage increases in positive,
then the channel width increases in depletion mode.
·
The drain current ID through
the channel increases.
·
If the applied gate
voltage more negative, then the channel width is very less and MOSFET may enter
into the cutoff region.
·
The depletion mode
MOSFET is rarely used type of transistor in the electronic circuits.
·
V-I characteristic
mainly gives the relationship between drain- source voltage (VDS)
and drain current (ID).
·
The small voltage at the
gate controls the current flow through the channel.
·
The channel between
drain and source acts as a good conductor with zero bias voltage at gate
terminal.
·
The channel width and
drain current increases if the gate voltage is positive and these two (channel
width and drain current) decreases if the gate voltage is negative
.
you are clear my mind actually after reading your article i got clear my complete doubt. thanks for such easy understanding post. I also got some similar at here just for your info i post here link may be useful for future aspect difference between enhancement and depletion type mosfet
ReplyDelete